Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials

Name: Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials
Start: 2026-11-05T19:00:00-07:00
End: 2026-11-05T20:30:00-07:00
Location: Engineering Center

Data, AI & ML 05.11.2026 / Πέμπτη / 19:00 - 20:30 Engineering Center, 1111 Engineering Drive, Boulder, CO 80309 Διοργανωτής: College of Engineering and Applied Science Αγορά εισιτηρίων

Darren Hitchcock, senior business development manager, Panasonic will cover how how package and PCB material choices affect signal integrity, manufacturability, and performance in high-speed systems.

This presentation is in association with CU Boulder’s High Speed Digital Engineering (HSD) Program. We aim to connecting students, researchers, and industry professionals through technical talks on signal integrity, packaging, PCB design, interconnects, power integrity, and modern high-performance computing.